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  • Weidy Express
    • Hot Keywords : Ceramic Capacitors / Interference Suppression Film Capacitors / Varistors

    Behind each product is a set of processes that have been
    fine tuned and thoroughly refined

    Material selection

    Processing and material selection plans for product reconfiguration

    Design

    Product design and structural design, and customer solution design reconstruction

    Hot pressing

    Flattening and nesting to shape the product

    Baking

    105-120° high-temperature heat treatment

    Metal spraying

    Uniform spraying, auxiliary connection

    Curing

    Metal spray sealing, curing, and exterior encapsulation

    Burr treatment

    Uniform burr treatment

    Aging

    Product aging

    Soldering

    Special soldering, ensuring chip central placement and preventing offset

    Printing

    Clear laser printing of model numbers, parameters and logos

    6T Technology · Reshaping Product Baselines

  • 6T Technology · Reshaping Product Baselines

    Additional grooves or protrusions at ceramic edges to extend the discharge path and effectively make the edge electric field uniform.

  • Anti-offset soldering process

    The soldering is specially designed to ensure the central placement of the chip and prevent offset.

  • High-pressure plastic sealing process

    Compared with the ordinary hot melt encapsulation, this product adopts high-pressure plastic sealing, making it more dense.

  • Synchronized visual inspection process

    Marking, printing, and CCD visual inspection synchronization.

  • Full-inspection voltage-resistance testing process

    One-to-one testing of instruments and products to ensure the testing validity.

  • Packaging process

    Products are automatically tested and packed to replace manual operations.
    • For more production processes
    please click here
    Mobile : +86-755-82565888
    E-mail : wd@szweidy.com
    Address : 506-508, 5/F New Asia Electronic Town, Zhenzhong Road, Futian District, Shenzhen

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