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For 10 years, our "mission" has remained unchanged, to be the long-term, stable leader in 6T processes for film capacitors

  • Special chip design

    Additional grooves or protrusions are made along the ceramic edges to extend the discharge path, so as to effectively homogenize the edge's electric field.
  • Anti-offset soldering

    The soldering process is specially designed to ensure the center position of the chip and prevent offset.
  • High-pressure plastic sealing

    Compared with ordinary hot-melt sealing, high-pressure plastic sealing is used for this product for better tightness.
  • Full-inspection pressure-resistance testing

    Instruments and products are tested one-by-one to ensure the effectiveness of testing.
  • Product labeling and testing

    Product labeling and CCD appearance inspection are carried out in parallel, saving time and effort.
  • Realization of automation

    The realization of automatic testing and product packaging reduces manpower.
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